teecons socket

HIGH PERFORMANCE TEST SOCKET

Rolling Contact Design
Self–cleaning wipe actions create a higher
first yield with lighter pad abrasion.
  • Simple maintenance
  • Higher first pass yield
  • Lower overall cost of testing
  • Consistent contact resistance
  • Longer MTBA (Mean time between assists)
  • Improved OEE (Overall equipment efficiency)
Seesaw-Like T Pin Design

Perfectling the balance of load (IC) and force (elastomer) to minimize the friction between T pins and their housing.

Perfect Rolling Guarantees Minimum PCB Pad Damage

High Quality Contact Surface Reduces Sn Accumlation.
Surface Roughness: 0.08a (super-finish surfac)

CONTACT US

HEAD OFFICE
Taoyuan (Taiwan)

Phone: +886-3-3557608
Fax: +886-3-3557205
Email: sales@tekcrown.com






WEE TEST SOCKETPOGO PINSTAMPED SPRING PROBEC3 COATINGTF+ SUBSTRATETEECONSPARIPOSERCHANGE KITCONTACT FINGERRF SYSTEMPROBE STATION SYSTEM