High performance test socket, rolling contact design.
Self–cleaning wipe actions create a higher first yield with lighter pad abrasion.
STAMPED SPRING PROBE
High performance & cost effective with stamping process.
Enabling small diameter for 0.15mm fine pitch.
The Griffin III is superior cost-effective solution for mass production, engineering and failure analysis test applications.
Testing Logic IC handler.
Smart Motion Control robot control technology enables fast movement with low vibration when transferring semiconductors.